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Co-authors
- Jose Silva-MartinezDept. of ECE, Texas A&M UniversityVerified email at tamu.edu
- Dong-Ho LeeHanbat National UniversityVerified email at hanbat.ac.kr
- Dzuhri Radityo UtomoDepartment of Electrical and Information Engineering, Universitas Gadjah MadaVerified email at ugm.ac.id
- Hyunki JungKorea Advanced Institute of Science and TechnologyVerified email at kaist.ac.kr
- Sang-Gug LeeProfessor of Electrical Engineering, KAISTVerified email at kaist.ac.kr
- Kyung-Sik ChoiETH ZürichVerified email at ethz.ch
- Sebastian HoyosProfessor of Electrical and Computer Engineering, Texas A&M UniversityVerified email at tamu.edu
- Keun-Mok KimQualcommVerified email at qti.qualcomm.com
- Kamran EntesariTexas Instruments Engineering Professor of Electrical Engineering, Texas A&M UniversityVerified email at tamu.edu
- Ahmed A. Helmysenior Engineer, Qualcomm Technologies IncVerified email at neo.tamu.edu
- Hafiz Usman MahmoodStaff Engineer, Point2Technology Inc.Verified email at point2tech.com
- Berke CetinoneriApple Inc.Verified email at apple.com
- Han-Shin JoProfessor, Hanyang UniversityVerified email at hanyang.ac.kr
- Sangkil KimPusan National UniversityVerified email at pusan.ac.kr
- Bon-Hyun KuQualcomm Technologies, Inc.Verified email at qti.qualcomm.com
- Cam NguyenProfessor of Electrical and Computer Engineering, Texas A&M UniversityVerified email at ece.tamu.edu